Common Items

I cannot tell if the package drawing of a 3-pin power mini mold (SC-62) is the top view or the bottom view.

The bottom view is shown so that it is easy to recognize the pin shapes of the collector and source at the center.

(2007/04)

Please tell me how to find the pin 1 position in a 4-pin or 6-pin package.

When placing the package in a direction that you can read the marking, Pin 1 is the pin in the bottom left corner.
In the RF & microwave products, the Pin 1 position varies from one product to another. Refer to the data sheet of each product.

(2007/04)

Are SC-62 and SOT-89 the same?

SC-62 is the name given by the Electronic Industries Association of Japan (EIAJ) and SOT-89 is the name given by Joint Electronic Device Engineering Council (JEDEC, an American industrial organization) that promotes standardization of electronic components). Although the names differ, the package shapes are the same.

(2006/10)

Does NEC Electronics have its own original name for a discrete package?

MP-**, for a package relating to a power device, is the original name given by NEC Electronics.

(2006/10)

What is the operating temperature range of transistors, diodes, etc.?

Among semiconductor products, integrated circuit products are useless if their circuits do not function, and therefore the (circuit) operating temperature range is specified.
Discrete devices such as transistors and diodes do not by themselves have circuit functions, and therefore no operating temperature range is specified for them.
Use such products within the storage temperate range.

The lower limit of the usage temperature range is the storage temperature range, but the upper limit is restricted by the junction temperature.
For example, if the absolute maximum rating for the junction temperature is 150 °C, such as in a transistor, perform derating so that the junction temperature does not exceed 150 °C.

We may on occasion use packages such as the TO-220 with a fin attached to the package for heat dissipation purposes.
We would like to know the withstand voltage of packages as a voltage of about 1.5 KV is supplied to the cooling fin in such cases.

Unfortunately, the withstand voltage of the TO-220 and other packages has not been measured.
Please request this information from your authorized NECEL distributor.

What is the meaning of the letters "JM" at the end of the part number "2SD1701-AZ/JM" on the product label?
Does the package of this product differ from a standard product?

"JM" indicates the country (or countries) in which the product was manufactured.

First letter… Country in which diffusion process was carried out: J = Japan
Second letter…Country in which assembly process was carried out: M = Malaysia

This product is also a standard product, and therefore there are no differences in the packages and characteristics.

(2006/03)

Upon purchasing the 2SD1694, I requested a "K" rank product, but the label on the product says "KM".
Is this actually a "K" rank product? What is the meaning of "M" in this case?

Products described as "KM" are "K" rank products. "M" is an internal control symbol used by NEC Electronics whose meaning cannot be disclosed publicly.

(2006/03)

What is the meaning of the letter "L" that is described in the part number of the 3-pin minimold product (Sc-59) that I ordered?

Generally, "L" means magazine packing container.
Other packing container symbols include "T1B" and "T2B", which are used for tape packing containers. Any packing container symbol is always included in the part number for ordering.
The RF & microwave products are not packed in a magazine packing container, but in tape packaging container with each tape containing 50 products.

(2007/04)

What does the (0) affixed to some transistor or FET order numbers mean?

(0) is an automotive electronics compliance symbol and means that the product is a high-quality, high-reliability product suitable for automotive applications.

(2006/07)

How is the specification for automotive electronics in discrete products different from one for general-purpose?

The automotive specification product has higher quality and reliability than the general-purpose product because the reliability standards for automotive products, in addition to those for general-purpose products, are specifically defined so that the management of the production facilities and processes is stricter than for general-purpose.

(2008/02)

What is the meaning of the term "infinite heat sink" that appears on the total power dissipation vs. ambient temperature graph in power transistor and power MOS FET documentation?

This is assumed to mean "infinite heat sink ≈ Tc = 25°C". In other words, the case temperature must be kept to 25°C by attaching an extremely large heat radiator and externally dissipating the heat at the junction.

(2006/03)

Two conditions are described for the total dissipation parameter in the power ratings of a power transistor or a power MOS FET: T_A = 25°C and T_C = 25°C. What is the difference between these conditions?

The specification at T_A = 25°C in the power ratings refers to the total power dissipation of a discrete semiconductor element in an environment with an ambient temperature of 25°C.
In this case, the thermal resistance from the heat source to the ambient air is expressed as R_th(j-a).

The specification at T_C = 25°C in the power ratings refers to the total power dissipation when the semiconductor element (case) itself has been forcibly cooled, i.e., when temperature of the package surface is kept at 25°C.
Note that the ratings may include the note "with infinite heat sink". However, in actual use, it is very difficult to make the package surface temperature exactly 25°C, and if you also take derating into account, the allowable power will in fact be somewhere in between T_A = 25°C and T_C = 25°C.

Related FAQ items
Thermal Design

(2006/07)

The condition described in the absolute maximum rated total power dissipation for SC-62 products says when mounted on ceramic substrate, but what exactly is a ceramic substrate?

A ceramic substrate is formed by shaping a material such as ceramic in the form of a plate and then firing it to harden it. Since ceramic substrates offer excellent heat dispersion characteristics compared to glass epoxy substrates, they are often used for comparatively large-power ICs such as hybrid ICs.

(2006/12)

The 2SD1000 (SC-62) is specified as having total power dissipation of 2 W when mounted on a ceramic substrate, but what is the total power dissipation when it is mounted on a glass epoxy substrate?

The total power dissipation of 2 W when the 2SD1000 (SC-62 package) is mounted on a ceramic substrate has been obtained from a thermal resistance between the junction and ambient of 62.5°C/W.
Since the thermal resistance between the junction and ambient is 150°C/W when the 2SD1000 is mounted on a glass epoxy substrate, calculation based on this figure gives [W = (150°C - 25°C)/150°C/W], resulting in 0.8 W at ambient 25°C.
Regarding the total power dissipation-ambient temperature characteristics, refer to the PT-TA graph in the data sheet taking into consideration the line connecting 25°C = 0.8 W and 150°C = 0 W in the PT-TA graph.

(2006/10)

What items do I need to confirm when selecting a transistor or MOS FET?

You should confirm at least the following items.

Rating of VCEO and VDSS	→	Power supply voltage + margin
Rating of IC and ID	→	Load current + margin
Package	→	Size and mounting method
Rating of PT	→	Maximum ambient temperature during use
hFE and gate operating voltage	→	hFEand gate operating voltage according to circuit design
VCE(sat),RDS(on)	→	Effect of power consumption
NF,Ga,fT	→	Effect of high-frequency characteristics

(2007/04)

The surface-mount packages of the TO-220 include the TO-220SMD (MP-25Z) and TO-263 (MP-25K, MP-25ZP). How do these packages differ?

The TO-263 (MP-25K, MP-25ZP) and the TO-220SMD (MP-25Z) do not differ greatly in terms of appearance.
However, the MP-25ZP guarantees operation on a large current (110 A).

The TO-220SMD (MP-25Z) is a JEITA (Japan Electronics and Information Technology Industries Association) standard package for use within Japan.

The TO-263 (MP-25K, MP-25ZP) is a JEDEC (Joint Electron Device Engineering Council) standard package.

(2006/04)

Some of the old transistors include green mold resin.
Did green mold resin actually exist in the past products manufactured by you?

Green mold resin was used for PNP type transistors until December 1994. From January 1995, this has been replaced by black resin for all transistors.
Therefore, green mold resin exists in PNP type transistor lots up to December 1994.

(2006/11)

Is flow (wave) soldering of surface mounting products possible?

In the case of packages without radiating fins, such as the SC-59 and SOP, flow (wave) soldering is possible, but in the case of packages that have radiating fins on their rear surface, such as the SC-62, TO-252, and TO-220SMD, a solder connection between the rear-surface radiating fins and the substrate cannot be sufficiently achieved with flow (wave) solder, and the use of flow (wave) soldering is not recommended in this case.

(2006/10)

What is the junction-case thermal resistance of the SC-62 (power minimold)?

The junction-case thermal resistance of the SC-62 package is not specified (there is no specification for the total dissipation at T_C = 25°C).
A reference value would be about 30°C/W.

(2007/01)

I want to confirm if there is any heat-related problem by measuring the temperature of the case surface when using the SC-59 (minimold) package product. Can you please tell me the junction-case thermal resistance of this package?

The SC-59 (minimold) package is not used with a heat sink, so the junction-case thermal resistance is not specified.
It is therefore not possible to determine usage conditions depending on the case temperature.
Please use the following "Total Power Dissipation vs. Ambient Temperature" characteristics graph, which is included in the SC-59 products' data sheets, to determine whether the product can be used in your application.

(2008/01)

A distributor has notified us that we should avoid using the 2SC945A in new designs, even though it has not been discontinued.
Are there any replacement products that are not planned to be discontinued?

Small-signal type THD products, including the 2SC945A, are in the process of being phased out. We recommend that they not be used in new designs.
As replacements, we recommend that you consider surface-mount type products such as the 2SC1623 or 2SC4177.

(2007/09)

The FAQ has the following about the operating temperature range: "Use with derating so that the junction temperature does not exceed 150°C." What exactly should be done for this derating?

When a case temperature is 100°C in the example shown in the figure, in order to operate in the safe operating range, the power consumption must be limited to less than 40% of that at 25°C. Derating refers to lowering the usage conditions, taking into consideration the ambient temperature around elements and the rise in temperature generated by the elements themselves.
In the case of use in the area above 40% in the figure, the junction temperature exceeds the absolute maximum rating of 150°C.

(2007/10)

What do the symbols of the absolute maximum ratings of transistors and FETs represent?

The symbols mean the following.
In V_(1)(2)(3), the symbols stand for the following:

(2008/02)