SITE MAP  CONTACT US

Volume 68 (July 20, 2007)

Overview of Papers Presented at IITC 2007 (1/3)

The world's most advanced wiring technology was announced at the IEEE International Interconnect Technology Conference (IITC) 2007, which was held from June 4 to June 6, 2007 in San Francisco, California. Engineers from NEC Electronics and NEC Corporation introduced their joint research results at this year's conference.

What is IITC?

IITC is the IEEE international organization that specializes in interconnect issues from the system level, including silicon semiconductor wiring processes and integration, wiring design, and matters related to implementation, antennas and other RF wiring technology. The conference has been held in San Francisco in June of every year since 1998. This year's 600-700 participants included many equipment vendors, semiconductor manufacturers and semiconductor materials vendors, so vendor seminars and exhibits were held at the same time. About 25% of the 120 or so contributed papers were presented orally and a little less than half were presented in poster sessions. Topics included wiring technology for 22-, 32- and 45-nanometer (nm) nodes, low-k and other process technologies, carbon nanotube technology, RF technology, and implementation technology such as 3D. Historically, Japan has had the most papers accepted, but recently more papers are being submitted from researchers in Korea, Taiwan and other Asian countries. Most of the papers submitted and accepted by universities and research organizations are from Europe and the U.S., followed by Asian countries other than Japan, indicating that much basic research and development is being done in Europe and the U.S. Four articles from the NEC Group and the NEXST collaboration team, whose members are NEC Electronics, SONY and Toshiba, were adopted.

• Visit the IITC website

Papers from NEC Electronics

Two papers accepted for IITC are summarized below.

| 1   2   3 |

AdvancedParametric