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Volume 59 (Aug 31, 2006)
Summary of NEC Electronics Papers Presented at the 2006 Symposia on VLSI Technology and Circuits (1/5)
The "2006 Symposia on VLSI Technology and Circuits"—recognized as the premiere conference for presenting research results on the latest device, process, and circuit-related developments—were held at the Hilton Hawaiian Village Hotel in Honolulu June 13 to 17 and featured a number of papers presented by NEC Electronics in collaboration with NEC.
VLSI Symposia Overview
A unique strength of the event is that the two symposia—the VLSI Technology symposium and the VLSI Circuits symposium—are held at the same location during the same week. The VLSI symposia are major conferences along with the International Electron Devices Meeting (IEDM) and the International Solid-State Circuits Conference (ISSCC). The VLSI Technology symposium focuses on device and process-related themes. The VLSI Circuit symposium addresses circuit-related technologies. At this year's VLSI Technology symposium, 92 papers were accepted out of 296 submissions. There was an increase in papers dealing with front-end-related issues such as high-k, metal gates, and stained silicon channels. A good number of papers dealt with nonvolatile memory. For the VLSI Circuits symposium, 113 papers were selected from among 412 submissions; papers covered a broad range of topics, including new design concepts for memory, processor, communication, and analog and signal processing circuits.
Along with the technical work presented at the conferences, one-day short courses were also offered: a short course on "Process Technologies for Continued Scaling and Performance" was presented at the VLSI Technology symposium, while lectures dealing with "Data Converter Design for Embedded Systems" and "Designing for Paradigm Shift in Microprocessors and Networking" were offered at the VLSI Circuits symposium.
Visit the official web site for the VLSI symposia at
Papers Presented by NEC Electronics
Eight papers by NEC Group authors were selected for presentation at the two symposia: one by NEC Electronics researchers alone, and three written in collaborations between NEC Electronics and NEC researchers.
<<Paper Titles>>
- Session 4-4: Advanced Gate Dielectric Reliability
- Session 14-1: Advanced Interconnect Technology
- Session 17-2: Novel Architectures and Process Integration
- Session 19-4: Advanced CMOS Technology
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