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Products > ASIC > Cell-Based IC > Product Lineup > CB-10VX/VXLIO >

Package Lineup: VXLIO Type (80 µm Pad Pitch)


  
 

TQFP

CB-10VXLIO 80um Pad pitch
Body size (mm) 7 10 12 12 14 14
Pin 48 64 64 80 100 120
Code TVGA-9EU VUGB-YEU TWGK-9ET TXGK-9EU SUGC-9EU VRGC-YEB
Lead pitch (mm) 0.5 0.5 0.65 0.5 0.5 0.4
Body thick (mm) 1 1 1 1 1 1
L/F Cu Cu 42 42 Cu Cu
Matrix Matrix Matrix Matrix   Matrix
Step Pad1 Pad2 I/O
A34H8T 104 96 96 O O O O    
A59H8T 120 112 112 O O O O O  
A98H8T 144 136 136 O O O O O O
B23H8T 160 152 152 O O O O O O
B49H8T 176 168 168   O O O O O
B74H8T 192 184 184   O O O O O
C00H8T 208 200 200   O O O O O
C26H8T 224 216 216   O O O O O
C51H8T 240 232 232   O O O O O
C77H8T 256 248 248   O O O O O
D02H8T 272 264 264     O O O O
D28H8T 288 280 280     O O O O
D54H8T 304 296 296       O O O
D79H8T 320 312 312       O O O
E05H8T 336 328 328       O O O
E30H8T 352 344 344       O O O
E56H8T 368 360 360       O O O

O : Determination of assembly possibility (However, please consult NEC Electronics on your actual use.).
Pad1 : Total pad count    Pad2 : Usable pad count except 8 pads of corner areas.



LQFP

CB-10VXLIO 80um Pad pitch
Body size (mm) 10 12 14 14 20 24 20 24 24
Pin 44 64 64 100 144 160 176 176 216
Code TUGB-8ES 64GK VYGC-8BS TYGC-8EU XGGJ-8EU SAGM-8ED VVGJ-UEV VVGM-UEU M6GM-8EV
Lead pitch (mm) 0.8 0.65 0.8 0.5 0.5 0.5 0.4 0.5 0.4
Body thick (mm) 1.4 1.4 1.4 1.4 1.4 1.4 1.4 1.4 1.4
L/F 42 Cu 42 42 Cu Cu Cu Cu Cu
Step Pad1 Pad2 I/O
A98H8T 144 136 136 O O O O O        
B23H8T 160 152 152 O O O O O        
B49H8T 176 168 168 O O O O O O      
B74H8T 192 184 184 O O O O O O O O  
C00H8T 208 200 200 O O O O O O O O  
C26H8T 224 216 216 O O O O O O O O  
C51H8T 240 232 232 O O O O O O O O  
C77H8T 256 248 248 O O O O O O O O O
D02H8T 272 264 264 O O O O O O O O O
D28H8T 288 280 280 O O O O O O O O O
D54H8T 304 296 296   O O O O O O O O
D79H8T 320 312 312   O O O O O O O O
E05H8T 336 328 328   O O O O O O O O
E30H8T 352 344 344   O O O O O O O O
E56H8T 368 360 360   O O O O O O O O

O : Determination of assembly possibility (However, please consult NEC Electronics on your actual use.).
Pad1 : Total pad count    Pad2 : Usable pad count except 8 pads of corner areas.



PBGA (1/2)

CB-10VXLIO 80um Pad pitch
Body size (mm) 27 27 27 27 27 27 27 27 35 35
Pin 256 272 300 316 336 352 400 449 352 388
Code WNS1-B6  T2S1-B6 W0F1 X6F1 ARF1 AGF1 BAF1 BSF1 AGS1-F6 AJS1-F6
GND 16 16 16 16 16 16     16 16
VDD1 8 8 8 8 8 8     8 8
VDD2 8 8 8 8 8 8     12 12
Signal 224 224 268 268 304 304 332 332 316 316
Ball pitch (mm) 1.27 1.27 1.27 1.27 1.27 1.27 1 1 1.27 1.27
Body thick (mm) 2.13 2.13 2.13 2.13 2.13 2.13 2.13 2.13 2.33 2.33
Step Pad1 Pad2 I/O
A34H8T 104 96 96                    
A59H8T 120 112 112                    
A98H8T 144 136 136                    
B23H8T 160 152 152                    
B49H8T 176 168 168                    
B74H8T 192 184 184                    
C00H8T 208 200 200                    
C26H8T 224 216 216                    
C51H8T 240 232 232 O O                
C77H8T 256 248 248 O O                
D02H8T 272 264 264 O O                
D28H8T 288 280 280 O O O O            
D54H8T 304 296 296 O O O O            
D79H8T 320 312 312 O O O O            
E05H8T 336 328 328 O O O O         O O
E30H8T 352 344 344 O O O O         O O
E56H8T 368 360 360 O O O O O O     O O

O : Determination of assembly possibility (However, please consult NEC Electronics on your actual use.).
Pad1 : Total pad count    Pad2 : Usable pad count except 8 pads of corner areas.



PBGA (2/2)

CB-10VXLIO 80um Pad pitch
Body size (mm) 35 35 35 35 35
Pin 420 484 480 544 609
Code BFS1 BLS1 BBF1 CLS1 DHF1
Signal 372 372 432 432 440
Ball pitch (mm) 1.27 1.27 1.27 1.27 1.27
Body thick (mm) 2.33 2.33 2.33 2.33 2.23
Step Pad1 Pad2 I/O
A34H8T 104 96 96          
A59H8T 120 112 112          
A98H8T 144 136 136          
B23H8T 160 152 152          
B49H8T 176 168 168          
B74H8T 192 184 184          
C00H8T 208 200 200          
C26H8T 224 216 216          
C51H8T 240 232 232          
C77H8T 256 248 248          
D02H8T 272 264 264          
D28H8T 288 280 280          
D54H8T 304 296 296          
D79H8T 320 312 312          
E05H8T 336 328 328          
E30H8T 352 344 344          
E56H8T 368 360 360          

O : Determination of assembly possibility (However, please consult NEC Electronics on your actual use.).
Pad1 : Total pad count    Pad2 : Usable pad count except 8 pads of corner areas.



FPBGA (1/3)

CB-10VXLIO 80um Pad pitch
Body size (mm) 8 9 10 11 12 13 13
Pin 73 80 113 108 180 144 160
Code 73F1-CA3 80F1-CN4 B3F1-DA3 A8F1-DN3 J0F1-EA5 E4F1-ENA G0F1-EN9
Ball pitch (mm) 0.8 0.8 0.8 0.8 0.8 0.8 0.8
Body thick (mm) 1.28 1.48 1.28 1.48 1.28 1.48 1.48
Step Pad1 Pad2 I/O
A34H8T 104 96 96 O O          
A59H8T 120 112 112 O O O O      
A98H8T 144 136 136 O O O O      
B23H8T 160 152 152 O O O O   O  
B49H8T 176 168 168 O O O O   O O
B74H8T 192 184 184 O O O O   O O
C00H8T 208 200 200 O O O O O O O
C26H8T 224 216 216   O O O O O O
C51H8T 240 232 232   O O O O O O
C77H8T 256 248 248   O O O O O O
D02H8T 272 264 264     O O O O O
D28H8T 288 280 280     O O O O O
D54H8T 304 296 296     O O O O O
D79H8T 320 312 312       O O O O
E05H8T 336 328 328       O O O O
E30H8T 352 344 344       O O O O
E56H8T 368 360 360         O O O

O : Determination of assembly possibility (However, please consult NEC Electronics on your actual use.).
Pad1 : Total pad count    Pad2 : Usable pad count except 8 pads of corner areas.



FPBGA (2/3)

CB-10VXLIO 80um Pad pitch
Body size (mm) 14 15 15 16 17 19 19
Pin 157 176 208 224 281 240 304
Code F7F1-FA3 H6F1-FN1 L8F1-FN3 N4F1-GA2 U1F1-GN1 Q0F1-HN3 W4F1-HN2
Ball pitch (mm) 0.8 0.8 0.8 0.8 0.8 0.8 0.8
Body thick (mm) 1.48 1.48 1.48 1.48 1.48 1.48 1.48
Step Pad1 Pad2 I/O
A34H8T 104 96 96              
A59H8T 120 112 112              
A98H8T 144 136 136              
B23H8T 160 152 152              
B49H8T 176 168 168 O            
B74H8T 192 184 184 O O          
C00H8T 208 200 200 O O          
C26H8T 224 216 216 O O O        
C51H8T 240 232 232 O O O O      
C77H8T 256 248 248 O O O O   O  
D02H8T 272 264 264 O O O O   O  
D28H8T 288 280 280 O O O O   O  
D54H8T 304 296 296 O O O O O O  
D79H8T 320 312 312 O O O O O O O
E05H8T 336 328 328 O O O O O O O
E30H8T 352 344 344 O O O O O O O
E56H8T 368 360 360 O O O O O O O

O : Determination of assembly possibility (However, please consult NEC Electronics on your actual use.).
Pad1 : Total pad count    Pad2 : Usable pad count except 8 pads of corner areas.



FPBGA (3/3)

CB-10VXLIO 80um Pad pitch
Body size (mm) 8 9 10 11 12 13 14 15 16
Pin 113 129 161 177 209 225 257 273 303
Code B3F1 C9F1 G1F1-DA1 H7F1 L9F1-EAA N5F1-EN6 R7F1-FA5 T3F1-FN4 W3F1-GA4
Ball pitch (mm) 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65
Body thick (mm) 1.43 1.43 1.43 1.43 1.43 1.43 1.43 1.43 1.43
Step Pad1 Pad2 I/O
A34H8T 104 96 96                  
A59H8T 120 112 112 O                
A98H8T 144 136 136 O O              
B23H8T 160 152 152 O O              
B49H8T 176 168 168 O O O            
B74H8T 192 184 184 O O O O          
C00H8T 208 200 200 O O O O          
C26H8T 224 216 216   O O O O        
C51H8T 240 232 232   O O O O O      
C77H8T 256 248 248     O O O O      
D02H8T 272 264 264     O O O O O    
D28H8T 288 280 280     O O O O O O  
D54H8T 304 296 296     O O O O O O  
D79H8T 320 312 312       O O O O O  
E05H8T 336 328 328       O O O O O O
E30H8T 352 344 344       O O O O O O
E56H8T 368 360 360         O O O O O

O : Determination of assembly possibility (However, please consult NEC Electronics on your actual use.).
Pad1 : Total pad count    Pad2 : Usable pad count except 8 pads of corner areas.