Please note that JavaScript and style sheet are used in this website,
Due to unadaptability of the style sheet with the browser used in your computer, pages may not look as original.
Even in such a case, however, the contents can be used safely.

Worldwide > Japan日本語

PARAMETRIC
ADVANCED

HOMEAPPLICATIONSPRODUCTSTECHNOLOGYSUPPORTPURCHASENEWS & EVENTSABOUT US

Applications > System Applications > Introduction to General-Purpose Products >

Third Generation Mobile Phones

MOSFETs Used for Power Supply and Battery Protection Blocks

In the area of discrete products for mobile phones, key demands of which are downsizing and low power consumption, NEC Electronics offers a line-up of MOSFETs that achieve low on-resistance by employing leading-edge process (0.25 µm) and wireless bonding implementation technologies. We are also rolling out a range of packages in response to the trend toward smaller and thinner devices.

Road Map

Figure 1:Downsizing of MOSFETs Protecting Li-ion Secondary Batteries in Mobile Phones

Circuit Diagram

Figure 2:Circuits in Power Supply and Peripheral Blocks in Mobile Phone

Li-ion Secondary Battery Protection Circuit in Mobile Phone
- Small-package dual N-Channel MOSFETs featuring low on-resistance

The 6pHWSON: a smaller and thinner package

	Footprint	Height	Weight
8pTSSOP	20mm²	1.2mm MAX	40mg
6pHWSON	10mm²	0.8mm MAX	19mg

Offers heat resistance equivalent to that of the previous 8pTSSOP
(Drain electrode is on the back of the substrate)

Figure 3:Comparison of Packages (Maximum Dimensions in mm)
Low on-resistance 8pTSSOP
µPA1872B: TYP 10 mΩ at Nch 20V
(For VGS=4.5 V)

High ID (pulse) withstand capability

Type No.	Package	Drain	VDSS (V)	VGSS (V)	ID (DC) (A)	Ron1 (mohm) typ/max VGS=4.5V	Ron2 (mohm) typ/max VGS=4.0V	Ron3 (mohm) typ/max VGS=2.5V
μPA1870B	8pTSSOP	Common	20	±12	±6.0	16.0/20.0	15.5/21.0	20.0/27.0
μPA1871	8pTSSOP	Common	30	±12	±6.0	20.5/26.0	21.5/27.0	27.8/38.0
μPA1872B *1	8pTSSOP	Common	20	±12	±10.0	10.0/13.0	10.5/13.5	13.0/18.0
μPA1873	8pTSSOP	Common	20	±12	±6.0	18.0/23.0	19.0/24.0	24.5/29.0
μPA1874B*1	8pTSSOP	Common	30	±12	±8.0	11.5/14.0	12.0/14.5	15.0/19.5
μPA2450B*1	6pHWSON	Common	20	±12	±8.6	12.5/17.5	13.0/18.5	18.0/27.5
μPA2450C*1	6pHWSON	Common	20	±12	±8.6	11.0/17.5	11.5/18.5	15.3/27.5
μPA2451B*1	6pHWSON	Common	30	±12	±8.2	15.0/20.0	15.5/21.0	22.0/32.0
μPA2452*1	6pHWSON	Common	24	±12	±7.8	17.5/21.5	18.5/22.5	25.0/30.0
μPA2754	SOP8	Separate	30	±12	±11.0	11.5/14.5	11.8/15.0	13.9/18.6

*1:Wireless bonding product TA= 25℃

Specification List

Power Management SW

Package : SC-96

Polarity	Type No.	Config	VDSS (V)	VGSS (V)	ID(DC) (A)	Ron1 (mohm) typ/max at1.8V	Ron2 (mohm) typ/max at2.5V	Ron3 (mohm) typ/max at4.5V	Ciss (pF) typ	Qg (nC) typ
Nch	2SK3576	Single	20	±12	±4.0	-	56/75	40/50	250	3.3
Pch	2SJ621	Single	-12	±8	±3.5	63/105	46/62	35/44	660	6.6
	2SJ624	Single	-20	±8	±4.5	65/108	53/71	43/54	813	8.1
	2SJ625	Single	-20	±8	±3.0	188/314	128/171	90/113	348	2.6

Package :SC-95

Polarity	Type No.	Config	VDSS (V)	VGSS (V)	ID(DC) (A)	Ron1 (mohm) typ/max at1.8V	Ron2 (mohm) typ/max at2.5V	Ron3 (mohm) typ/max at4.5V	Ciss (pF) typ	Qg (nC) typ
Nch	μPA1901	Single	30	±12	±6.5	-	40/54	31/39	470	5.4
Nch	μPA1970	Dual	20	±12	±2.2	-	80/107	55/69	160	2.3
Pch	μPA1916	Single	-12	±8	±4.5	59/98	41/55	30/39	950	8.0
	μPA1950	Dual	-12	±8	±2.5	225/375	160/205	105/130	220	1.9
	μPA1951	Dual	-12	±8	±2.5	140/234	100/133	70/88	270	2.4
	μPA1911A	Single	-20	±12	±2.5	-	122/190	82/115	370	2.3
	μPA1915	Single	-20	±12	±4.5	-	66/90	45/55	820	5.0
	μPA1919	Single	-20	±12	±6.0	-	63/84	46/58	682	6.0
	μPA1917	Single	-20	±8	±6.0	64/107	52/70	42/53	835	8.0
	μPA1952	Dual	-20	±8	±2.0	170/284	137/183	108/135	272	2.3
	μPA1981	LoadSW	-8	(-8)	-2.8	-	76/105	52/70(5V)	-	-

Package :6pWSOF

Polarity	Type No.	Config	VDSS (V)	VGSS (V)	ID (DC) (A)	Ron1 (mohm) typ/max at1.8V	Ron2 (mohm) typ/max at2.5V	Ron3 (mohm) typ/max at4.5V	Ron4 (mohm) typ/max at10V	Ciss (pF) typ	QG (nC) typ
Nch	μPA620TT	Single	20	±12	±5.0	-	40/54	30/38	-	450	5.5
Nch	μPA621TT	Single	20	±12	±5.0	-	59/79	40/50	-	270	3.3
Pch	μPA650TT	Single	-12	±8	±5.0	68/114	51/68	40/50	-	610	5.5
	μPA651TT	Single	-20	±8	±5.0	85/142	66/88	55/69	-	600	5.5
	μPA652TT	Single	-20	±12	±2.0	-	385/514	235/294	-	126	1.0
	μPA654TT	Single	-12	±8	±2.5	140/234	100/133	71/88	-	250	2.7

Package : 8LD3x2MLPM

Type No.	Package	Config	VDSS (V)	VGSS (V)	ID(DC) (A)	PT (W) #	Ron1 (mOhm) typ/max at 1.8V	Ron2 (mOhm) typ/max at 2.5V	Ron3 (mOhm) typ/max at 4.5V	Ciss (pF) typ	QG (nC) typ
μPA2610T1C	8LD3x2MLPM	Single	-20	±8	±5	1.9	85/142	66/88	55/69	600	5.5

#Mounted on Fr-4 board PW < 10sec

SC-88 6pin Super Mini Mold

Part No.	Polarity	VDS [V]	ID [A]	RDSON (ohm) typ/max VGS=1.5V	RDSON (ohm) typ/max VGS=2.5V	RDSON (ohm) typ/max VGS=4.0V
μPA672T	Nch	50	±0.1	-	20/40	15/20
μPA675T	Nch	16	±0.1	20/50	7/15	5/12
μPA677TB	Nch	20	±0.35	-	0.6/0.88	0.41/0.6
μPA678TB	Pch	-20	±0.25	-	2.25/2.98	1.25/1.55
μPA679TB	N/P	20	±0.25 /±0.35	-	0.6/0.88 2.25/2.98	0.41/0.6 1.25/1.55

SC-70 3Pin Super Mini Mold

Part No.	Polarity	VDS [V]	ID [A]	RDSON (ohm) typ/max VGS=1.5V	RDSON (ohm) typ/max VGS=2.5V	RDSON (ohm) typ/max VGS=4.0V
2SK1580	Nch	16	±0.1	-	9/15	6/10
2SK3663	Nch	20	±0.5	-	0.6/0.88	0.41/0.6
2SK1658	Nch	30	±0.1	-	25/45	18/25
2SK2858	Nch	30	±0.1	-	7/15	4/8
2SK1958	Nch	16	±0.2	20/50	7/15	5/12
2SJ202	Pch	-16	±0.1	-	70/100	23/30
2SJ463A	Pch	-30	±0.1	-	23/60	11/23
2SJ647	Pch	-20	±0.4	-	2.25/2.98	1.25/1.55

SC-75 Ultra Super Mini Mold

Part No.	Polarity	VDS [V]	ID [A]	RDSON (ohm) typ/max VGS=1.5V	RDSON (ohm) typ/max VGS=2.5V	RDSON (ohm) typ/max VGS=4.0V
2SK1824	Nch	30	±0.1	-	7/13	5/8
2SK3107	Nch	30	±0.1	-	7/15	4/8
2SK3664	Nch	20	±0.5	-	0.6/0.88	0.41/0.6
2SK3503	Nch	16	±0.1	20/50	7/15	5/12
2SJ648	Pch	-20	±0.4	-	2.25/2.98	1.25/1.55
2SJ243	Pch	-30	±0.1	-	55/100	20/25
2SJ559	Pch	-30	±0.1	-	23/60	11/23

System Application Home

Introduction to Key Devices

Third Generation Mobile Phone

LEGAL RSS Feeds Site Map